LED display uses SMD sticker packaging technology, and a new LED display package, COB display, has appeared in recent years. So many customers want to know the difference between COB display and LED screen, as well as the difference between the two packages, the following Apexls to take you to understand:

First, the difference between COB display and LED screen

1. Packaging technology differences

The conventional LED screen uses the table sticker SMD package, the technical process is cumbersome, requires a certain amount of operation time, the minimum point spacing can only be 1.2, even if the multi-in-one can be smaller, but still can not get rid of the problem of the lamp. The COB package simplifies the packaging process of the LED chip, directly integrates the LED chip on the PCB board, and the above glue is fixed, the process is simpler, there is no need to reflow, the LED chip is more stable, and the point spacing can be smaller.

2. Stability difference

Conventional LED display lamp beads are welded on the PCB board, collision is easy to drop the lamp, want to repair, only technicians to the site welding or directly replace the unit board, resulting in a high after-sales rate. The packaging protection of COB display is better, the anti-collision ability is better, and the lamp bead will not fall during installation and use, and the stability is greatly improved.

3. Difference in point spacing

Conventional LED display is limited by packaging technology, the point pitch is usually P1.2 and above, such as P1.2, P2.0, P3, P4, etc., its development limit is unable to achieve the point pitch below 1.2, resulting in screen resolution can not continue to improve, if the picture quality clarity requirements are relatively high occasions, it is not suitable for use. The COB display can achieve a smaller point spacing, such as the P1.2, P0.9 products that Kangshuo can provide are the use of COB packaging, mature technology, and higher picture clarity.

Second, COB display process

COB display six processes: material preparation - substrate processing - chip paste - welding - packaging - testing between

1. Material preparation

Including metal substrate, LED chip, packaging material, wire, etc., among which LED chip is the core component of COB process, its quality and performance directly affect the overall package quality. Packaging materials are generally selected

2. Handle the substrate

The metal substrate is treated with dirt removal and oxygen removal to ensure the cleanliness and smoothness of the surface of the substrate. Then, a layer of thermal adhesive is coated on the substrate to improve the heat conduction effect between the LED chip and the substrate.

3. Paste the chip

Paste the LED chip onto the treated metal substrate. When pasting, pay attention to the positioning and arrangement of the chip to ensure uniform distribution of light and maximize light efficiency. After pasting, special equipment is used to control the pressure and temperature, so that the chip and the substrate are closely combined.

Apexls P1.9 indoor COB display application

4. Weld

After the chip is pasted, the circuit between the chip and the substrate is connected by welding wires. During welding, the welding temperature and welding time should be controlled to avoid damage to the chip and substrate.

5. Encapsulation

After the packaging material is pre-treated, it is covered on the chip and substrate in a specific way. The selection of packaging materials should take into account factors such as mechanical properties, heat resistance and weather resistance. After the packaging is completed, it is necessary to undergo curing treatment to ensure the firmness and stability of the packaging material.

6. Testing and quality inspection

Through the packaging of LED products after electrical performance testing, optical performance testing and reliability testing, to ensure that the quality and performance of the product meet the requirements. At the same time, it is also necessary to carry out appearance inspection and packaging to meet market demand.

The above is the difference between the COB display and the LED screen, and the introduction of the COB display process. COB display is the mainstream development direction in the future, with high reliability, smaller spacing, wear resistance and many other advantages. If you want to know more about COB display and product consultation, please contact Apexls.